(Adopted 02-09-95)

101 DESCRIPTION: The purpose of this Rule is to limit the emissions of precursor organic compounds from semiconductor manufacturing operations. For the purpose of this Rule, semiconductor manufacturing operations are limited to the manufacture of semiconductor and other related integrated circuits.

102 EXEMPTION, SMALL SEMICONDUCTOR OPERATION: The provisions of Sections 302, and 501 shall not apply to any facility whose total combined negative photoresist maskant and negative photo resist developer consumption is less than 24 gallons per month on a facility wide basis and provided the requirements of Section 402 and Section 502 are met.

103 EXEMPTION, SOLVENT CLEANERS: The provisions of Sections 301 and 302 shall not apply to any vapor degreaser or cold cleaner utilizing solvent flow or with a capacity greater than 10 gallons. Such vapor degreasers or cold cleaners are subject to REGULATION 2, RULE 216, ORGANIC SOLVENT CLEANING AND DEGREASING OPERATIONS.

104 EXEMPTION, COMPOUNDS WITH LOW VOLATILITY: All compounds with an initial boiling point greater than 150C (302F) and where the initial boiling point exceeds the actual operating temperature by at least 100C (180F) are exempt from the requirements of Section 302.3
201 FREEBOARD HEIGHT: The distance from the top of the solvent or solvent drain to the top of the sink.

202 FREEBOARD RATIO: The freeboard height divided by the smaller of the length or width of the sink or reservoir.

203 MASKING: Application of a maskant material to a wafer to increase or decrease the masked area's resistance to chemical milling.

204 ORGANIC COMPOUND: Any compound of carbon, excluding methane, carbon monoxide, carbon dioxide carbonic acid, metallic carbides or carbonates and ammonium carbonate.

205 EXEMPT ORGANIC COMPOUNDS: For the purposes of this rule, exempt compounds are the following:

 206 PHOTORESIST LINE: Equipment used to apply and develop photoresist masking solution on a wafer. Process includes preparation (except primary cleaning), soft bake, develop and hard bake.
207 PHOTORESIST, NEGATIVE: Maskant hardens when exposed to light. Unhardened maskant is stripped, exposing wafer surface to etching. Typically uses xylene formulated resin and developer solutions.
208 PHOTORESIST, POSITIVE: Maskant softens when exposed to light. Softened maskant is stripped, exposing wafer surface for etching. Typically uses cellosolves for primer and resin carrier with caustic type developer.
209 SEMICONDUCTOR MANUFACTURE: Any operation performed in order to manufacture semiconductor or related solid state devices, such as semiconductor diodes and stacks, and including rectifiers, integrated microcircuits, transistors, solar cells, and light sensing and emitting devices. Semiconductor manufacture includes all processing from crystal growth through circuit separation and encapsulation. Examples of semiconductor operations are: crystal growth, diffusion operations, photoresist operations, wafer processing, etching, etc.

210 SOLVENT CLEANING STATION: Any operation whose primary purpose is to remove surface contaminants or to remove photoresist using a liquid or vapor containing organic compounds.
211 LIQUID SOLVENT LEAKS: A liquid leak of four drops or more per minute from secondary containment.

212 CONTAINERS: For the purposes of Section 301 and Section 302, a container is defined as having a total volume of 1 liter (0.264 gal) or less. Any container with a volume greater than 1 liter is considered a reservoir.

301 NEGATIVE PHOTORESIST OPERATIONS: All exhaust gases containing precursor organic vapors from negative photoresist operations shall be vented to control devices which reduce the total emission of precursor organic compounds to the atmosphere by at least 90 percent by weight.

302 SOLVENT CLEANING STATION LIMITS: A person shall not operate a solvent cleaning station at a semiconductor manufacturing facility unless exhaust organic vapors are vented to control devices that reduce the total emissions of precursor organic compounds to the atmosphere by at least 90% by weight or the following requirements are met:

401 RESERVOIRS AND SINKS COMPLIANCE SCHEDULE: Any existing facility subject to Section 302 of this Rule shall comply with the following increments of progress:

402 SMALL SEMICONDUCTOR OPERATION PETITION: Any person seeking to satisfy the conditions of Section 102 shall comply with the following requirements:

501 ANNUAL REPORTING: Any person subject to Sections 301 or 302 of this Rule shall report the following on an annual basis, prior to renewal of Permits to Operate:

502 RECORDS: Any person seeking to satisfy the conditions of Section 102 shall comply with the following requirements:

503 NEGATIVE PHOTORESIST SOURCE TESTS: Any person subject to Section 301 shall conduct a source test of the abatement device to demonstrate compliance. Results of the tests shall be submitted within 90 days of (Date of adoption by the Board of Directors), or 90 days after start up of affected equipment, whichever is later. The APCO shall be contacted in writing no less than 15 days prior to testing. Equipment that has previously undergone a District approved source test and successfully demonstrated compliance under Rule 244 requirements need not be retested.